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Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

January 8, 2024

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

January 8, 2024

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising

January 8, 2024

Company is leading the pack to bring affordable, high performance, power-optimized, scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centers, and mobile computing

SINGAPORE & LAS VEGAS, USA - 8 January 2024 - Silicon Box revealed today that its advanced SGD 2B packaging factory in Singapore has been in mass production for early customers since October 2023, shortly after the grand opening of the factory on July 20, 2023 (Silicon Box launches SGD 2B Advanced Packaging Fab). The 750,000 sq. foot facility has ramped up hiring for 24/7 operations. The company is already forecasting high demand on existing capacity and has successfully closed Series B funding to expand production rapidly.

Silicon Box was founded in 2021 by industry titans from semiconductor design and packaging. Co-founders Dr. Sehat Sutardja and Weili Dai previously founded and led Marvell Technology Group, where Dr. Sutardja was CEO and Ms. Dai was President, respectively. Co-founder and CEO, Dr. Byung Joon (BJ) Han, was formerly CEO of STATS ChipPAC (acquired by JCET in 2015) for twenty years. Dr. Sutardja and Dr. Han combined have more than 800 US patents and a long history of collaboration.

Notably, Silicon Box brings effective chiplet integration capabilities, through its state-of-the-art factory in Singapore. The chiplet concept itself was introduced by Dr. Sutardja at the International Solid State Circuits Conference (ISSCC) in 2015, where he was plenary speaker. Dr. Han is the inventor of semiconductor packaging products, currently shipping over 100 billion annually in unit volume, including quad flat no-lead (QFN).

"Silicon Box is well poised to solve the semiconductor industry's challenges for fast adoption of chiplet. We are leading the pack to bring high performance, power-optimized, affordable, and scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centers, and mobile computing globally," said Dr. BJ Han. "Our state-of-the-art factory and advanced panel level packaging are delivering a solution to scale high growth markets, such as AI accelerators, to the masses. This is our first multibillion-dollar factory and we are eager to scale rapidly to support our customers and partners."

Towards a Chiplet Future

Silicon Box is set to bring about a revolution with its semiconductor package design and fabrication methods, from the most advanced AI or edge systems to the simplest circuits.

Current semiconductor chips are hitting a wall in scalability, limited by conventional packaging approaches. Meanwhile, the development and manufacturing cost for chip designers have become cost prohibitive except for the most well-funded players, leaving the industry bottlenecked and consumers paying high prices.

Silicon Box enables chiplet architecture, allowing chip designers freedom from the constraints of a single, monolithic chip for processing. By leveraging multiple smaller chips, interconnected in a single package, chip designers can create the equivalent of "system-on-a-chip" (SoC) in a package. Chiplets enable dramatically better performance, smaller device sizes, and better device reliability. Most importantly, they make it easier for foundries, chip designers, and OSATs to collaborate to build chips for the most cutting-edge applications.

Additionally, Silicon Box's large production format sets a new industry standard for large scale, high yield production especially for advanced chiplet-based designs. The company's solutions are more reliable and cost effective due to the standardized packaging process for the shortest chiplet-to-chiplet interconnection, reducing the manufacturing costs for high performance devices by up to 90%, with better thermal and electrical performance. This is especially crucial for the high growth AI accelerator market. Expansion plans for the Singapore factory reflect the severe current shortage in advanced packaging solutions, and Silicon Box's commitment to enabling AI accelerator solutions and bringing them to the masses.

Initial collaborations with customers have yielded groundbreaking results. "We're deeply excited to partner with Silicon Box. Their unique packaging approach has dramatically shortened our time to market, while allowing us to gain a significant lead on our competitors," assured Ravi Krishnamoorthy, Vice President and Managing Director at Zerro Power Systems, a developer of next generation controllers and drivers.

Series-B

Silicon Box announced a successful $200M Series B fundraising round, bringing the company to over a one-billion-dollar valuation. All three founders were investors in the round. Other strategic investors into Silicon Box include BRV Capital; Event Horizon Capital; Grandfull Convergence Fund; Hillhouse Capital; the corporate venture arm of Lam Research, Lam Capital; Maverick Capital; Prasedium Capital; Tata Electronics; TDK Ventures; and UMC Capital.

"As we bump up against size and cost constraints in front-end SoC design, chiplet architectures are emerging as an innovative solution given their higher manufacturing yields and functional reuse of IP, among other benefits. Especially as industry standards align, chiplet adoption should grow rapidly," Andrew Homan, Managing Director and Technology Sector Head at Maverick Capital, explained. "Silicon Box is a key enabler of chiplet adoption, given its advanced packaging technologies that achieve industry leading interconnect density and power performance at a still cost-effective price point. We are committed to supporting BJ, Sehat, Weili and the Silicon Box team in catalyzing this important paradigm shift in chip production."

TDK Ventures Investment Director Henry Huang commented, "The Silicon Box chiplet design is truly innovation at its finest. The company's recently opened 750,000 square foot facility has proven the concept is totally viable, and competitors in the industry have already taken notice. TDK Ventures is proud to be a part of their success and eagerly look forward to supporting their future endeavors."

"Chiplets are the future and what Silicon Box has achieved for chiplet deployment, in a short time, already represents significant breakthroughs for the industry," said Kwan Yoon, Chief Investment Officer at BRV Capital. "Our team was impressed that Silicon Box delivered the most innovative solutions that are high performance, energy conscious, reliable and affordable while addressing such a key industry bottleneck. Silicon Box and its technologies are extremely important for the semiconductor industry, and the digital world."


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About Silicon Box

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge chiplet integration services. Founded in 2021 by Dr. BJ Han, Dr. Sehat Sutardja, and Weili Dai, the Singapore company is capable of collaborating on everything from initial design to final manufacturing of chiplets through its established relationships with best-in-class partners, has a track record of customer success and proprietary technology. Its state-of-art facility in Singapore provides advanced interconnection capabilities and demonstrates leadership in innovation at this critical epoch of semiconductor manufacturing technology. To learn more about Silicon Box, visit www.silicon-box.com/

Press and Interview Enquiries
Janice Yeo / Vicki Yeo, Media Contacts | Email: 
siliconbox@bulletbroadcast.io


Investor Enquiries
Mike Han, Head of Business | Email: 
mike.han@silicon-box.com


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ROME, Italy, December 19 - Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy . The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities. The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first manufacturing expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging. "This strategic investment in Italy represents a pivotal moment in Europe's semiconductor renaissance," says Dr. Byung Joon Han, Chief Executive Officer of Silicon Box. "By bringing our advanced packaging technologies to the heart of Europe, we're not just expanding our global footprint – we're creating a cornerstone of the EU's semiconductor ecosystem that will serve critical sectors from automotive to artificial intelligence." Project Details and Timeline The new first-of-its-kind advanced manufacturing facility in Novara will feature: Panel-level packaging and heterogeneous integration capabilities R&D center focusing on next-generation packaging solutions Industry 4.0 automated manufacturing systems Key net-zero technologies to minimize carbon footprint and environmental impact Construction is expected to begin in the second half of 2025, with initial production planned for Q1 2028. The plant is expected to be operating at full capacity in 2033, processing approximately 10,000 panels per week. Regional Impact and Partnerships Under the Italian measure, Silicon Box is committed to strengthening Italy’s and the wider EU semiconductor value chain by bringing in advancing packaging technologies, managing supply shortages through priority orders, and developing workforce training programs. Silicon Box is already in talks with the local government to develop partnerships with educational institutions and workforce programs to cultivate a robust native talent which will include technicians and maintenance workers with expertise in automation, robotics, mechatronics, computer science, and graduates in electronic, mechanical, management, chemical and physical engineering. “We're committed to creating high-quality jobs, fostering local partnerships, and driving technological advancements that will benefit our customers and the broader economy, " says Michael Han, Head of Business, Silicon Box. “Silicon Box would like to express our gratitude to the Ministry of Enterprises and Made in Italy, Piedmonte government, local officials, and our partners for supporting this expansion. Silicon Box remains committed to driving innovation, ensuring supply chain resilience, and contributing to the economic growth of Italy and beyond.” Silicon Box’s key manufacturing services will enable the adoption of chiplets and high-performance alternatives that require integrating a wide variety of technology nodes and materials. The plant will specialize in advanced packaging solutions for AI, high-performance computing (HPC), data centers, automotive, mobile, IoT and robotic applications, addressing Europe's growing demand for advanced chip technologies. ### Forward looking statement: This press release contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances. Such statements involve risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including: changes in demand for our products; Silicon Box’s failure to realize the anticipated benefits of its strategy, plans, and proposed transactions; construction delays or changes in plans due to business, economic, or other factors; increases in capital requirements and changes in capital investment plans; adverse changes in anticipated government incentives and associated approval related to Silicon Box’s planned EU investments; adverse legislative or other government actions; insufficient ecosystem support; the impact of macroeconomic and geopolitical trends and events; and other risks and uncertainties described in this press release. All information in this press release reflects management’s views as of the date hereof unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. Inquiries Media: janice.yeo@silicon-box.com | media_enquiries@silicon-box.com Investors: mike.han@silicon-box.com About Silicon Box Silicon Box is an advanced semiconductor packaging company, specializing in cutting edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high performance alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today. Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest outsourced assembly and test provider, STATS ChipPAC (SSE: 600584) for two decades, taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of the most advanced packaging solutions in today’s market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology Group (NASDAQ: MRVL) in 1995 and ran the company for twenty years from a start-up to an over $50B market value company. To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com
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