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WHAT WE OFFER

WHAT WE OFFER

  • Collaborative and flexible design

    We are committed to upfront customer engagement, co-design, and IP protection.

  • Fine design-rule solutions in compliance with BoW & UCle

    We design heterogeneous architecture that can be customisable and cost-efficient across a wide range of  performance and form factors.

  • IC integration and interconnection

    Our proprietary fabrication method provides sub 5 micron technology, setting an unmatched standard for design flexibility and electrical performance.

  • High-yield, large format manufacturing

    We offer advanced packaging solutions, low-cost production schemes, and the most efficient interconnection. 

  • Ecosystem collaboration

    We garner credibility and capability from our critical ecosystem of co-designing partners, advanced materials suppliers, and key equipment suppliers. 

  • State-of-the-art automated factory

    The foundry's resource-efficient facilities and integration methods enable high-performance solutions with low power consumption.

  • Collaborative and flexible design

    We are committed to upfront customer engagement, co-design, and IP protection.

  • Fine design-rule solutions in compliance with BoW & UCle

    We design heterogeneous architecture that can be customisable and cost-efficient across a wide range of  performance and form factors.

  • IC integration and interconnection

    Our proprietary fabrication method provides sub 5 micron technology, setting an unmatched standard for design flexibility and electrical performance.

  • High-yield, large format manufacturing

    We offer advanced packaging solutions, low-cost production schemes, and the most efficient interconnection. 

  • Ecosystem collaboration

    We garner credibility and capability from our critical ecosystem of co-designing partners, advanced materials suppliers, and key equipment suppliers. 

  • State-of-the-art automated factory

    The foundry's resource-efficient facilities and integration methods enable high-performance solutions with low power consumption.

How are chiplets  leading the semiconductor design revolution?

Semiconductor integration creates a more complex system that offers enhanced performance, improved power efficiency, and reduced form factor. It involves the integration of diverse technologies, such as digital logic circuits, analog circuits, sensors, memory elements, power management units, and more.


Chiplets play a crucial role in semiconductor integration.


A chiplet is a discrete, self-contained semiconductor component that performs a specific function or hosts a specific technology. Chiplets can be designed, manufactured, and tested independently of each other, and then combined or interconnected to form a larger and more complex integrated circuit.


Modularity and Flexibility

Chiplets can be developed independently, optimised for specific functionalities. This modularity facilitates flexibility in chip design, as different chiplets can be mixed and matched and tailored for specific applications. It allows for efficient use of resources, enables faster development cycles, and reduces time-to-market.

Specialization and Optimization

Each chiplet can be designed for a particular function, such as memory, graphics processing, or power management. This specialisation enables  higher performance, energy efficiency, and overall system-level optimisation.

Heterogeneous integration

The integration of different types of chips, such as those fabricated using different process technologies (e.g., CMOS, MEMS, photonics) or chips from different manufacturers, enables the combination of diverse functionalities and technologies on a single package, resulting in improved system-level capabilities and performance.

Yield Improvement

 If a chiplet fails during manufacturing or testing, only that specific chiplet needs to be discarded, rather than the entire integrated circuit. This selective testing and binning of chiplets results in higher overall yields and lower costs.

Heterogeneous integration

The integration of different types of chips, such as those fabricated using different process technologies (e.g., CMOS, MEMS, photonics) or chips from different manufacturers, enables the combination of diverse functionalities and technologies on a single package, resulting in improved system-level capabilities and performance.

Yield Improvement

 If a chiplet fails during manufacturing or testing, only that specific chiplet needs to be discarded, rather than the entire integrated circuit. This selective testing and binning of chiplets results in higher overall yields and lower costs.

Silicon Box’s proprietary fabrication method uses sub 5 micron technology , delivering one of the shortest interconnections in the industry and solving the unique challenges of chiplet adoption.


  • Interconnect density: As chiplets become smaller and more densely packed, there is a need to accommodate a higher number of connections within a limited space.


  • Power efficiency: With sub 5 micron technology, it is possible to optimise power usage by reducing resistive losses and minimising parasitic capacitance between chiplets.


  • Signal integrity: The use of sub 5 micron technology helps mitigate signal degradation issues by minimising crosstalk, reducing noise, and improving overall signal quality, leading to enhanced performance of chiplet-integrated devices.


  • Thermal management: Heat dissipation is a significant challenge in densely integrated chiplets. Our sub 5 micron technology enables the design and fabrication of more efficient thermal management structures, such as microchannels and heat sinks.


  • Design Flexibility: Sub 5 micron technology allows for the integration of diverse chiplets with varying sizes, functionalities, and interfaces, enabling tailored solutions for specific use cases.


Our advanced chiplet integration technology sets an unmatched standard for design flexibility and electrical performance at low cost and power consumption. This agility in semiconductor design cycles enables the industry to effectively and efficiently scale chiplet-based solutions across the semiconductor value chain.



ISO 9001:2015 Certificate

Our Singapore factory's ISO 9001:2015 certification in 2024 is a testament to our unwavering commitment to quality and customer satisfaction. This international recognition demonstrates our ability to consistently meet customer standards and regulatory requirements. We are also proud to be ISO14001:2015 and ISO45001:2018 certified, underscoring our commitment to sustainability management, and health & workplace safety. 

End-to-end commitment to resource efficiency at scale


  • NeWater is purified through a RODI reverse osmosis process for manufacturing processes. 


  • 50% of post-manufacturing waste water is recycled and reused.


  • Multi-grid voltage system and solar panels enables selective power consumption.


Premium facilities and fully-automated processing line



  • Advanced robotics facilitates focus on  computational and R&D.


  • A world-class 'clean room' and facilities to manufacture sub 5 micron chiplet interconnectivity.


  • We support the interconnection of AI processors, general processors, HPC, RF frontend, power management module, analog and motor drives.
     

Geopolitically neutral, business friendly location

 


  • Singapore offers a politically stable environment, allowing the company to mitigate geopolitical tension.  


  • The city-state's robust IP protection and labor laws provide a secure environment for the sensitive semiconductor manufacturing trade. 

End-to-end commitment on resource efficiency at scale

  • NeWater is purified through a RODI reverse osmosis process for manufacturing processes. 


  • 50% of post-manufacturing waste water is recycled and reused.



  • Multi-grid voltage system and solar panels enables selective power consumption.


Premium facilities and fully-automated processing line

  • Advanced robotics facilitates focus on  computational and R&D.


  • A world-class 'clean room' and facilities to manufacture sub 5 micron chiplet interconnectivity.


  • We support the interconnection of AI processors, general processors, HPC, RF frontend, power management module, analog and motor drives.
     

Geopolitically neutral, business friendly location

  • Singapore offers a politically stable environment, allowing the company to mitigate geopolitical tension.


  • The city state's robust IP protection and labor laws provide a secure environment for an already sensitive semiconductor manufacturing trade. 

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