Logo

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

July 22, 2023

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

July 22, 2023

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

Silicon Box launches $2 billion, state-of-the-art advanced semiconductor packaging fab in Singapore to accelerate the future of computing and the AI Era

July 22, 2023

With chiplets at the forefront of semiconductor integration, the factory is ready to support its global customers and partners.

Singapore, July 2023 – Silicon Box, a cutting-edge semiconductor startup, today unveiled its SGD 2 billion advanced semiconductor packaging fab aimed at revolutionising the chip manufacturing sector, developing local capabilities, and boosting Singapore’s position as a global hub for semiconductor manufacturing. Silicon Box will hire and train thousands of high-level employees, with the support of the Singapore Economic Development Board (EDB).


The grand opening ceremony of the 73,000 sqm facility in Tampines, the size of 15 football fields, was graced by Mr Png Cheong Boon, Chairman EDB, and the company’s three co-founders Dr. Han Byung Joon - Chief Executive Officer of Silicon Box - Dr. Sehat Sutardja - Chairman of the board, and Weili Dai.


“Silicon Box is well poised to solve the unique challenge for chiplets, which are essential to power emergent technologies. Our team of experts with over 30 years of experience, critical ecosystem of partners, and proprietary interconnection technology will shorten the design cycle of chiplets, lower new device costs, reduce power consumption and enable faster-time-to-market for industry partners involved in areas such as artificial intelligence (AI), data centres, electronic vehicles (EVs), mobile, and wearables” Dr. BJ Han says.


“At MeetKai, we are thrilled to have partnered with Silicon Box and have barely touched the surface of what promises to be very fertile ground for enterprise and industrial use cases in the metaverse. As a disruptive leader in the metaverse space, it gives us great pride to work with a company moving so disruptively in the Semiconductor space. Our heavy usage of AI has given us a first hand look at the needs for mass disruption in the semiconductor space. By automating training and monitoring capabilities, we hope to set the groundwork for Silicon Box to scale to many more factories even faster,” said MeetKai Co-Founder and CEO, James Kaplan. “Using advanced AI-powered and metaverse technologies, we were able to create  a full digital twin of Silicon Box’s state of the art advanced packaging fab in a matter of days, providing the capabilities for professional training, orientation tours, and live creative collaboration at fractions of the cost and time that were previously thought possible.” Created by meetkai


Transforming the semiconductor industry with advanced chiplet interconnection technology

Despite its wide potential and high demand across emerging technologies, deployment of chiplets continues to face challenges with manufacturing capacity, complexity and cost.


“The concept of chiplets – building larger systems on chips with modular components produced at scale – allows us to enable chip designers to focus on optimizing for performance and low power consumption in large chip designs, at a cost that is not prohibitive,” Dr. Sehat Sutardja explains. “Silicon Box’s proprietary fabrication method, sets a new standard for design flexibility and electrical performance at low cost. This agility in semiconductor design cycles enables the industry to take advantage of the chiplet concept and bring designs that double computing performance, at up to four times lower costs for graphical processors and high-performance computing chips, and up to half the cost for more widely consumed mobile processors.”


World Class Partnerships and Global Industry Adoption

Silicon Box has formed partnerships globally with industry leaders to enable semiconductor solutions required to power next generation applications. “What the users of tomorrow will expect when it comes to their end experience, whether it is on a mobile device, electric vehicle, or an end application utilizing generative AI, requires fundamentally different approaches to semiconductor manufacturing such as the advanced panel level packaging technology in which Silicon Box stands at the forefront. ” Co-Founder Weili Dai added. “We founded Silicon Box to meet this demand. This is our first multi billion dollar factory and we are eager to scale rapidly to support our customers and partners, globally. Many of these customers and partners have come to the Grand Opening to celebrate this key moment for Silicon Box and the industry, with us. We believe this is a testament to the faith they have in our capability.”


Jodi Shelton, CEO of the Global Semiconductor Alliance, showed the industry's far reaching support with her attendance adding, “I’m very proud to be part of this launch and celebration, at the Grand Opening. Seeing the factory, what the team has accomplished, and their decades of industry leadership, track record, and success, leaves me very optimistic about the future of Silicon Box, and what it means for the global industry.”


Developing talent for qualitative transformation of the manufacturing sector

Digitalisation, accelerated by the pandemic, has increased demand for talent in high-end engineering. Leveraging the combined expertise and patents of the co-founders of Silicon Box and commitment to R&D, the startup aims to attract the brightest minds and digital experts to join the innovative team at the facility. In collaboration with EDB, Silicon Box will be providing training opportunities for graduates from institutes of higher learning to contribute to the development of radical new technologies to meet this demand.


Silicon Box is a Singapore-based, global champion in semiconductors that will bring the city-state to the forefront of innovation in the space. It will help facilitate further development of native supply chains and technologies for this critical industry.


EDB’s Chairman Png Cheong Boon said, “Singapore is home to a vibrant and sophisticated semiconductor industry, with a strong ecosystem of solution providers and partners. Silicon Box’s decision to set up its first manufacturing and R&D facility in Singapore is testament to our competitiveness as a critical global node for semiconductors, and a vote of confidence in the long-term growth prospects of the sector in Singapore. We will continue to strengthen our industry’s competitiveness by developing a stronger talent pipeline, reducing the sector’s carbon footprint and deepening our semiconductor R&D capabilities.


JTC’s Director of Biomedical & Electronics Cluster Group Mr Cheong Wee Lee said, “Silicon Box brings its cutting-edge design capabilities and proprietary packaging system in chiplets to an established semiconductor ecosystem at Tampines Wafer Fab Park, where it can collaborate and build partnerships with industry players. We are pleased to support Silicon Box in the development of its purpose-built facility which will house R&D and manufacturing functions under one roof, enabling it to ramp up operations quickly and shorten time-to-market to meet customer demands.”


End-to-end commitment on economic resource efficiency at scale

Operating with economically sound processes to minimise the negative effects on the environment, Silicon Box ensures that its interconnected chiplets are energy efficient at scale. Built with resource efficiency in mind in keeping with industry best practices, the facility includes:

  • A Reverse Osmosis De-Ionized (RO-DI) water filtration system that purifies NeWater for manufacturing processes.
  • Fully contained wastewater treatment facility enables 50% of post-manufacturing waste water to be recycled and reused.
  • Multi-grid voltage system and solar panels improve the capacity of transmission lines and distributes power consumption more efficiently.
  • Energy efficient window glass and blinds, coupled with high-quality insulation, reduces energy required for cooling.


About Silicon Box

Silicon Box is an advanced chiplet interconnection company specialising in cutting-edge advanced semiconductor packaging. Founded in 2021 by Dr. BJ Han, Dr. Sehat Sutardja, and Ms. Weili Dai, the Singapore company is capable of collaborating on everything from initial design to final manufacturing of chiplets through its established relationships with best-in-class partners, has a track record of customer success and proprietary technology. Its state-of-art facility in Singapore provides advanced interconnection capabilities and demonstrates leadership in innovation at this critical epoch of semiconductor manufacturing technology. To learn more about Silicon Box, visit www.silicon-box.com


About MeetKai Inc.
MeetKai Inc. is a Metaverse and Artificial Intelligence company based in Los Angeles, California. Listed by Forbes as a leading innovator in the space, MeetKai's cutting-edge AI can give personalized results in a natural conversation and boast expertise about any subject inside the metaverse. After reaching 50+ million users worldwide, MeetKai launched the most cost-effective and easy-to-use metaverse creation tools in the market and is currently building virtual worlds rooted in reality and true utility, accessible to everyone, via browser. Visit
www.meetkai.com for more info and the latest MeetKai news.


Press and Interview Enquiries

jan@bulletboadcast.io or vicki@bulletbroadcast.io


Investor Enquiries

Michael Han, Head of Business | mike.han@silicon-box.com

Share on


Four female engineers standing together for a photo
February 13, 2025
At Silicon Box, this future is driven by tenacious and resilient women revolutionizing the semiconductor industry through a passion for innovation and an unwavering commitment to excellence that allows our customers to break limits.
January 14, 2025
Meet Beth, a dedicated team member whose journey in the semiconductor industry showcases her unwavering commitment to professional growth. Captivated by the fast-paced and innovation-driven nature of the field, Beth eagerly embraces new challenges while nurturing her passion for continuous learning.
December 19, 2024
ROME, Italy, December 19 - Silicon Box, a global leader in advanced semiconductor packaging and system integration, welcomes the European Commission's approval of approximately €1.3 billion for its new manufacturing facility in Italy . The project, representing a total investment of €3.2 billion, will create 1,600 high-skilled jobs and establish Europe's most advanced semiconductor packaging facilities. The investment supports the EU's strategic goal to produce 20% of the world's semiconductors by 2030 and marks Silicon Box's first manufacturing expansion beyond Singapore. With its proprietary large format panel-level process lines, the factory can scale up the packaging of chips 6 to 8 times more than traditional wafer-level packaging. "This strategic investment in Italy represents a pivotal moment in Europe's semiconductor renaissance," says Dr. Byung Joon Han, Chief Executive Officer of Silicon Box. "By bringing our advanced packaging technologies to the heart of Europe, we're not just expanding our global footprint – we're creating a cornerstone of the EU's semiconductor ecosystem that will serve critical sectors from automotive to artificial intelligence." Project Details and Timeline The new first-of-its-kind advanced manufacturing facility in Novara will feature: Panel-level packaging and heterogeneous integration capabilities R&D center focusing on next-generation packaging solutions Industry 4.0 automated manufacturing systems Key net-zero technologies to minimize carbon footprint and environmental impact Construction is expected to begin in the second half of 2025, with initial production planned for Q1 2028. The plant is expected to be operating at full capacity in 2033, processing approximately 10,000 panels per week. Regional Impact and Partnerships Under the Italian measure, Silicon Box is committed to strengthening Italy’s and the wider EU semiconductor value chain by bringing in advancing packaging technologies, managing supply shortages through priority orders, and developing workforce training programs. Silicon Box is already in talks with the local government to develop partnerships with educational institutions and workforce programs to cultivate a robust native talent which will include technicians and maintenance workers with expertise in automation, robotics, mechatronics, computer science, and graduates in electronic, mechanical, management, chemical and physical engineering. “We're committed to creating high-quality jobs, fostering local partnerships, and driving technological advancements that will benefit our customers and the broader economy, " says Michael Han, Head of Business, Silicon Box. “Silicon Box would like to express our gratitude to the Ministry of Enterprises and Made in Italy, Piedmonte government, local officials, and our partners for supporting this expansion. Silicon Box remains committed to driving innovation, ensuring supply chain resilience, and contributing to the economic growth of Italy and beyond.” Silicon Box’s key manufacturing services will enable the adoption of chiplets and high-performance alternatives that require integrating a wide variety of technology nodes and materials. The plant will specialize in advanced packaging solutions for AI, high-performance computing (HPC), data centers, automotive, mobile, IoT and robotic applications, addressing Europe's growing demand for advanced chip technologies. ### Forward looking statement: This press release contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances. Such statements involve risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including: changes in demand for our products; Silicon Box’s failure to realize the anticipated benefits of its strategy, plans, and proposed transactions; construction delays or changes in plans due to business, economic, or other factors; increases in capital requirements and changes in capital investment plans; adverse changes in anticipated government incentives and associated approval related to Silicon Box’s planned EU investments; adverse legislative or other government actions; insufficient ecosystem support; the impact of macroeconomic and geopolitical trends and events; and other risks and uncertainties described in this press release. All information in this press release reflects management’s views as of the date hereof unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. Inquiries Media: janice.yeo@silicon-box.com | media_enquiries@silicon-box.com Investors: mike.han@silicon-box.com About Silicon Box Silicon Box is an advanced semiconductor packaging company, specializing in cutting edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high performance alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today. Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest outsourced assembly and test provider, STATS ChipPAC (SSE: 600584) for two decades, taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of the most advanced packaging solutions in today’s market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology Group (NASDAQ: MRVL) in 1995 and ran the company for twenty years from a start-up to an over $50B market value company. To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com
Man standing on top of a roof covered with solar panels
November 14, 2024
Suresh is our go-to person for facility-related issues. He has a background in electrical and mechatronic engineering, along with enthusiasm for hands-on work and a diverse range of responsibilities.
Employee wearing blue standing in a hallway holding a white helmet.
October 12, 2024
Meet Joanne Chin, a friendly and supportive team member whose commitment and hard work have been instrumental in ensuring that our advanced test and packaging processes operate efficiently.
September 25, 2024
This month, we shine the spotlight on Azam Ali, a talented individual who makes impactful contributions to improvements in our advanced integration processes. Steadfast in his core values, his personality inspires those around him.
Hweeling, employee working in the lobby of Silicon Box HQ
July 3, 2024
This month, we spotlight Hwee Ling, a friendly and approachable colleague who is always welcoming you with a big warm smile. She is a strategic influencer and an innovative problem solver in our Business Division.
Silicon Box at MIMIT
June 28, 2024
Advanced packaging facility in Piedmont to bring first-of-a-kind semiconductor manufacturing capabilities to Europe, enable chiplet architecture
Image of Elston, an employee in the lobby of Silicon Box's HQ
May 15, 2024
Are you building a career in the semiconductor industry? Read this article to get some tips from Elston on achieving success and thriving in this exciting field.
Founders Dr. Sehat Sutardja, Weili Dai and Dr. Byung-Joon with MIMIT Minister Adolfo Urso
March 11, 2024
Investment in Northern Italy (Nord Italia), will bring first-of-its-kind, end-to-end chiplet based semiconductor system integration to Europe.
More Posts

We use cookies to ensure that we give you the best experience on our website. To learn more, go to the Privacy Page.

×
Share by: