Senior Packaging Designer

Position Summary

Senior Packaging Designer (BGA & Substrate & WLCSP) is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Key Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:
• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers
• Generate test vehicle design and the related PCB design
• Prepare design risk assessment report
• Generate reticle and stencil design
• Generate other schematics or drawing as requested
• Review, maintenance and update the design guidelines
• Manage the conversion of internal design into suppliers’ final design
• Document all the drawing revisions and change records
• Support audits

Requirement

• 5~10 years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
• Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors
• Familiar with PCB test board design
• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process will be the advantage

To apply for this job, email your details to hr@silicon-box.com