We are committed to upfront customer engagement, co-design, and IP protection.
We design heterogeneous architecture that can be customisable and cost-efficient across a wide range of performance and form factors.
Our proprietary fabrication method provides sub 5 micron technology, setting an unmatched standard for design flexibility and electrical performance.
We offer advanced packaging solutions, low-cost production schemes, and the most efficient interconnection.
We garner credibility and capability from our critical ecosystem of co-designing partners, advanced materials suppliers, and key equipment suppliers.
The foundry's resource-efficient facilities and integration methods enable high-performance solutions with low power consumption.
We are committed to upfront customer engagement, co-design, and IP protection.
We design heterogeneous architecture that can be customisable and cost-efficient across a wide range of performance and form factors.
Our proprietary fabrication method provides sub 5 micron technology, setting an unmatched standard for design flexibility and electrical performance.
We offer advanced packaging solutions, low-cost production schemes, and the most efficient interconnection.
We garner credibility and capability from our critical ecosystem of co-designing partners, advanced materials suppliers, and key equipment suppliers.
The foundry's resource-efficient facilities and integration methods enable high-performance solutions with low power consumption.
Semiconductor integration creates a more complex system that offers enhanced performance, improved power efficiency, and reduced form factor. It involves the integration of diverse technologies, such as digital logic circuits, analog circuits, sensors, memory elements, power management units, and more.
Chiplets play a crucial role in semiconductor integration.
A chiplet is a discrete, self-contained semiconductor component that performs a specific function or hosts a specific technology. Chiplets can be designed, manufactured, and tested independently of each other, and then combined or interconnected to form a larger and more complex integrated circuit.
Chiplets can be developed independently, optimised for specific functionalities. This modularity facilitates flexibility in chip design, as different chiplets can be mixed and matched and tailored for specific applications. It allows for efficient use of resources, enables faster development cycles, and reduces time-to-market.
Each chiplet can be designed for a particular function, such as memory, graphics processing, or power management. This specialisation enables higher performance, energy efficiency, and overall system-level optimisation.
The integration of different types of chips, such as those fabricated using different process technologies (e.g., CMOS, MEMS, photonics) or chips from different manufacturers, enables the combination of diverse functionalities and technologies on a single package, resulting in improved system-level capabilities and performance.
If a chiplet fails during manufacturing or testing, only that specific chiplet needs to be discarded, rather than the entire integrated circuit. This selective testing and binning of chiplets results in higher overall yields and lower costs.
The integration of different types of chips, such as those fabricated using different process technologies (e.g., CMOS, MEMS, photonics) or chips from different manufacturers, enables the combination of diverse functionalities and technologies on a single package, resulting in improved system-level capabilities and performance.
If a chiplet fails during manufacturing or testing, only that specific chiplet needs to be discarded, rather than the entire integrated circuit. This selective testing and binning of chiplets results in higher overall yields and lower costs.
Our advanced chiplet integration technology sets an unmatched standard for design flexibility and electrical performance at low cost and power consumption. This agility in semiconductor design cycles enables the industry to effectively and efficiently scale chiplet-based solutions across the semiconductor value chain.
Our newly opened foundry is the most advanced interconnection factory in the world. Located in Tampines, Singapore, spanning 73, 000 square metres in total size, with 30, 000 square metres of production space, the factory runs on self-contained CUB power, water, gas, and thermal resource management facilities.
In keeping with industry best practices and Singapore’s requirements around sustainability, the $2 billion advanced semiconductor manufacturing foundry is built with resource efficiency in mind.
Reg. No.: 202117750K
20 Tampines Industrial Avenue 3, Singapore 529580
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