SILICON BOX
The Forefront of Semiconductor Integration
SILICON BOX
The Forefront of Semiconductor Integration
Multi-Sectoral Expertise
Events
Learn more about Silicon Box's technology - come meet and hear from us.
Bloomberg New Economy - Thriving in an Age of Extremes
November 19 - 21, 2025
Dr. BJ Han will be on the worldwide platform for dialogue and discourse about economic transformation in growth markets. The forum convenes leaders from across government and private enterprise to confront the greatest challenges to global prosperity and to collaborate on solutions.
Global Industry Career Connect 2025 | 16 & 17 Oct 2025
Silicon Box will be at the National Technological University of Singapore (NTU) to meet graduating students. Attend to explore diverse job opportunities, get 1:1 interviews, walk-in sessions, and guidance from experienced mentors. Register here.
Imec’s 6th Automotive Chiplet Forum (ACF) | 16 & 17 Oct 2025
Dr. Han will deliver a keynote about chiplets and Silicon Box. Automotive and semiconductor industries are moving beyond research into scalable, real-world deployment of chiplet-based platforms. The exclusive event brings together stakeholders from across the ecosystem – OEMs, Tier 1s, semiconductor leaders and researchers – to accelerate the path from innovation to industrialization.
BCG GrowthTech Leaders Forum | 5 Oct 2025
Dr. Han joined other founders and CEOs to share openly about scaling, sustaining momentum, and leading through disruption. Hosted by Managing Director and Partner of BCG Singapore, Tarandeep Singh. Get a recap here.
AICON x BeyondXpo 2025: The Future, Reimagined Together | 18 Sep 2025
Mike Han, Head of Business, presented Silicon Box at the world’s #1 consumer AI show. With the theme “AI for Everyone,” AICON x BeyondXpo 2025 makes the future of technology accessible and inspiring.
NEXTGEN TECH 30 | 16 Sep 2025
Silicon Box has been named one of https://nextgen.graniteasia.com/, awarded to Asia’s most ambitious growth-stage companies reimagining how the world works, consumes, and connect.
Deal Street Asia's PE-VC Summit 2025 - Enterprise Corner: Of balancing runway, bottom-line and ambitions | 11 Sep 2025
Dr. BJ Han joins Aaron Tan (Carro), Kelly Wong (VNG Group) on a founders’ session about building through a trough year – H1 2025 was a six-year low for SEA venture with early-stage softness, valuation pressure and a private-debt pullback – even as Q2 showed a selective rebound with capital concentrating in fewer, higher-quality rounds (notably US$10–25m and select late stage). Get a recap on why these CEOs prefer profit over pace.
Events
Learn more about Silicon Box's technology - come meet and hear from us.
Deal Street Asia PE-VC Summit 2025: Venture Capital & Founders Summit
ENTERPRISE CORNER: OF BALANCING RUNWAY BOTTOM LINE AND AMBITIONS
Date: 11 September 2025
Time: 4:30 pm – 5:15 pm
Panel session with
- Aaron Tan, Co-Founder & Group CEO, Carro
- Kelly Wong, CEO, VNG Group
- Dr. BJ Han, Co-Founder, Board Director and CEO, Silicon Box
- Aastha Maheshwari, Senior Reporter, Indonesia, DealStreetAsia [Moderator]
With Aaron Tan (Carro), Kelly Wong (VNG Group) and Dr. BJ Han (Silicon Box), this founders’ session gets practical about building through a trough year – H1 2025 was a six-year low for SEA venture with early-stage softness, valuation pressure and a private-debt pullback – even as Q2 showed a selective rebound with capital concentrating in fewer, higher-quality rounds (notably US$10–25m and select late stage). Against that backdrop, this session will unpack how to balance runway, profitability and ambition across very different models – from Carro’s shift to disciplined profitability ahead of a potential U.S. listing, to VNG’s platform recalibration (Zalo, ZaloPay, games), to Silicon Box’s deep-tech scale-up after a US$302.5m Series B and Singapore’s S$2b advanced-packaging ramp. Expect pointed questions on the operating levers, governance choices, and capital stacks (equity, structured, venture debt) that work now – for SEA founders and the 40% of our audience building from outside the region.
KEYNOTE: Advanced Packaging & Heterogeneous Integration Summit
On 21 May 2025, Dr. Han gave a keynote at the Advanced Packaging & Heterogeneous Integration Summit at SEMICON SEA 2025.
The semiconductor industry is experiencing a significant transformation as chiplet architectures and advanced packaging technologies redefine the limits of system integration, performance, and scalability. Dr. Han’s opening keynote provided an overview of the progress and challenges in current semiconductor manufacturing. His presentation focused on how chiplets are becoming a key solution for high-power technologies, particularly in the field of AI. Dr. Han will discuss the challenges of heterogeneous integration, including interoperability, design for performance, adoption of IPs, communication standards, device reliability, and cost realization. Additionally, he explored solutions that could accelerate the adoption of chiplet technology, marking the beginning of a new era in advanced packaging.
Leonardo Awards 2025
On April 15th, Dr. Han was awarded the Leonardo International Prize for his significant contributions to Italy's technological landscape.
