Head of Operations

JH Yee has 37 years of in-depth and diverse experience in many of new package development, Process Engineering, Corporate function and manufacturing from Korea, Singapore, and China. Mr. Yee brings his global expertise and know-how to Silicon Box’s production and operation teams.

Mr. Yee was a leader of the team at Amkor that developed QFN package – the highest volume package produced today – as one of the main inventors, leading package design, and mass production.

While Head of Process Engineering at STATS ChipPAC, Mr. Yee worked to improve process capability at their Singapore factory. While based in China, he led R&D for high stack memory card, launching flipchip package/technology and copper wire bonding transformation. Later on, he was leading manufacturing organisation to drive revenue and quality. He ended his tenure at STATS ChipPAC as Head of Assembly

Manufacturing for their Korea hub.

Mr. Yee holds his Bachelor’s Degree in Metallurgical Engineering from Korea’s Hongik University in 1984.